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Extra info for Advances in Joining of Ceramics, Volume 138
05 pm), compared with the surface of metals (Cu, Ni and Ti). Valence Auger analysis across the bond-interface was carried out to examine the atomic interaction between metal and ceramics 2» 10>. The effect of metallization on alumina surfaces on Ti/Al203 bonding was examined. The metallization was carried out by vacuum deposition. The thickness, dm, of Ti deposition layer onto the A1203 surface was changed from 0 to 160 nm. The annealing (metallizing) was carried out for 30 min at the bonding temperature before bonding.
A. Dominguez-Rodriguez, F. Guiberteau and M. Jimenez-Melendo, "Heterogeneous junction of yttria partially stabilized zirconia by superplastic flow", J. Mater. , 13: 1631-1636, 1998. 22. C. S. Lee, L. C. De Jonghe and G. Thomas, "Mechanical properties of polytypoidally joined Si3N4-Al203", Acta Mater, 49: 3767 - 3773,2001. 23. H. Fukushima, T. Yamanaka, and Matsui, "Microwave heating and its application to joining", J. Mater. Res. 5: 3 9 7 - 405,1990. 24. P. A. A. Whitaker, "An Investigation into Microwave Bonding Mechanisms via a Study of Silicon Carbide and Zirconia," J.
Corff, I. E. Reimanis and B. H. Rabin. "Fabrication of Graded Nickel-Alumina Composites with a Thermal-Behavior-Matching Process," Journal of the American Ceramic Society 83  2147-54 (2000). 5 J.
Advances in Joining of Ceramics, Volume 138